Qualcomm may borrow Samsung's cooling tech for its next Snapdragon flagship - Hallo sahabat Software Foxed, Pada Artikel yang anda baca kali ini dengan judul Qualcomm may borrow Samsung's cooling tech for its next Snapdragon flagship, kami telah mempersiapkan artikel ini dengan baik untuk anda baca dan ambil informasi didalamnya. mudah-mudahan isi postingan Artikel News, yang kami tulis ini dapat anda pahami. baiklah, selamat membaca.

Judul : Qualcomm may borrow Samsung's cooling tech for its next Snapdragon flagship
link : Qualcomm may borrow Samsung's cooling tech for its next Snapdragon flagship

Qualcomm may borrow Samsung's cooling tech for its next Snapdragon flagship

The Heat Pass Block first appeared in Samsung's 2nm Exynos 2600, reportedly delivering a 16 percent improvement in thermal resistance. It's a copper-based layer built directly onto the processor die, providing a direct pathway for heat to dissipate before it can radiate through surrounding components.

Read Entire Article

Demikianlah Artikel Qualcomm may borrow Samsung's cooling tech for its next Snapdragon flagship

Sekianlah artikel Qualcomm may borrow Samsung's cooling tech for its next Snapdragon flagship kali ini, mudah-mudahan bisa memberi manfaat untuk anda semua. baiklah, sampai jumpa di postingan artikel lainnya.

Anda sekarang membaca artikel Qualcomm may borrow Samsung's cooling tech for its next Snapdragon flagship dengan alamat link https://softwarefoxed.blogspot.com/2026/02/qualcomm-may-borrow-samsungs-cooling.html