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Judul : Samsung planning to stack HBM memory on top of CPUs and GPUs arriving in 2025
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Samsung planning to stack HBM memory on top of CPUs and GPUs arriving in 2025

Samsung introduced its newest and most advanced chip packaging technology and service roadmap during the Samsung Foundry Forum 2024 event. According to unnamed industry sources quoted by the Korea Economy Daily and Samsung's own statements, the new tech will debut in fourth-gen high-bandwidth memory due out in 2025.

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